- Part 657

IDRBT Postdoctoral Scheme, India: Banking Technology

Identify and encourage promising young researchers with talent and innovative ideas to work on focal areas of research of the Institute.
Bring on board Ph.D degree holders within three years of award of Ph.D degree or those who have submitted Ph.D thesis to undertake critical research projects successfully and thereby contribute to the IDRBT’s research initiatives.
Develop and deliver working prototypes for commercial use in due course.
Bright minds, who need an opportunity to carry out research and development, will get an opportunity of working in areas relevant to IDRBT.

Areas of Research:

IPDFs shall bring with them in-depth knowledge in their area and would utilize it to work out IT based solutions in various areas of Banking Technology. They would carry out Research in one of the following areas or any other technology area, relevant to banking, and acceptable to the IDRBT.

* Financial Networks and Applications.
* Electronic Payment and Settlement Systems.
* Security Technologies for the Financial Sector.
* Financial Information Systems and Business Intelligence.
* Banking Analysis.
* Financial Inclusion.
* Core Banking System Related Challenges.
* Mobile Banking / Payments.
* Enterprise Data Models and Architectures for Banks.
* UML for Bank Systems and Applications.
Eligibility:

* Ph.D in Computer Science, Networks, Security or in an above cited area, and within three years of being awarded the Ph.D degree or those who have submitted their Ph.D thesis.
* Ph.D of the candidate and the proposed research should be in the areas relevant to IDRBT.
* Has sufficient IT background in terms of knowledge and utilization of IT systems, tools and techniques.
* Has a flair for Research and Development based problems-solving.
* Accepted research publications in high-impact journals.
* Not beyond 35 years of age.

Fellowship Application Deadline: This is a rolling scheme and applications received for selection will be evaluated from time to time

Further Fellowship Information and Application

Postdoctoral Position: Nanoelectromechanical Switch Devices for Logic Application, Switzerland

There is an immediate opening for a postdoctoral research position in the nanofabrication group at the IBM Research – Zurich laboratory for research on nanoelectromechanical (NEM) switch devices for logic applications.

To overcome the power issue of current CMOS technology, the microelectronic industry needs radically new devices that drastically improve the energy efficiency of microelectronic systems. One promising — yet still largely unexplored — technology is based on NanoElectroMechanical (NEM) switches, which are expected to produce significant improvements in energy efficiency. In this project, we are investigating the viability of this technology by developing a competitive and manufacturable device platform, by performing materials research to address inherent reliability issues, and by developing tools and methodologies to build complex logic.

To strengthen our interdisciplinary team, we are seeking a highly motivated individual with very good interpersonal skills and a strong background in designing and testing NEM systems as well as in applied materials science.

The successful candidate will play an important role in the design and testing of NEM devices. Â Hence we are seeking candidates who have a thorough understanding of the physics related to nanoscale electromechanical devices, experience in the design and characterization of such devices as well as extensive experience in using multi-physics simulation tools (such as ANSYS). Good knowledge of micro- and nanofabrication in addition to familiarity with logic design would be an asset.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application

Postdoctoral Position in Advanced Packaging, Switzerland

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application