thermal management | Scholarship for Nigerians and Africans

Postdoctoral Position in Fuel Cell Research, Masdar Institute of Science & Technology, Abu Dhabi

We are seeking a post-doctoral research associate in the area of computational/experimental thermal sciences. The project aims at investigating water and thermal management of PEM fuel cells under transient conditions. Candidates with Ph.D. in Mechanical Engineering, Chemical Engineering or a related field and research experience in CFD methods are encouraged to apply. Experience in fuel cell modeling is desirable. The position provides excellent opportunity of international collaboration (particularly with MIT) and excellent compensation package (salary range: US$ 60,000 – 70,000 per year).

About Masdar Institute:Masdar Institute of Science and Technology, located in Abu Dhabi, U.A.E., is a private, not-for-profit, independent, graduate-level, research-driven institute developed with the support and cooperation of Massachusetts Institute of Technology (MIT). The goal of the Institute is to develop, over a period of years, indigenous R&D capacity in Abu Dhabi, addressing issues of importance to the region in critical areas such as: renewable energy, sustainability, environment, water resources and microelectronics. The Institute offers graduate degree programs (MSc & PhD) in science and engineering disciplines with a focus on advanced energy and sustainable technologies

How to apply: Please send your application with a detailed resume and a list of 3 references to Professor Tariq Shamim, Mechanical Engineering, Masdar Institute of Science & Technology, P.O. Box 54224, Abu Dhabi, UAE. Phone: +971(2) 810-9158. Electronic submission of application is greatly preferred. Email: tshamim-at-masdar.ac.ae

Fellowship Application Deadline: Contact Employer

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University of Nottingham, Research Associate in Design Research, 2011

Applications are invited for the above post within the Energy and Sustainability Research Division, to design, manufacture and test a prototype for a thermal energy store utilising metal hydrides as a high energy density medium. This project is part of an E.ON International Research Initiative investigating novel thermal energy storage technologies for concentrated solar power plants.

The successful candidate will undertake an exciting project to create detailed specifications and, working with sub-contractors, the conceptual and embodiment design for the thermal store, support infrastructure and testing instrumentation/programme. A particular challenge will be the design and validation of an efficient thermal management system for the store, enabling a fast response when the store is either being charged or discharged. The project requires working within an inter-disciplinary team to design, build and validate the prototype. Operating in a safe manner is important to the project and the candidate will also undertake directed HSS training to ensure an exceptional level of HSS is delivered within the project. As a more senior member of the team, the person appointed will contribute to the training and supervision of PhD students working in the group. Duties will also include the liaison with E.ON and other partners in the project, the preparation and presentation of reports at regular intervals, and the development of academic publications for the dissemination of results to a wider audience.Candidates must hold a BEng (or equivalent) in an appropriate field (for example materials engineering/science, chemical engineering, physical science) and have design experience in engineering, preferably mechanical engineering. They must also have experience/understanding of project management and be able to demonstrate an ability to develop creative solutions to problems. Good verbal and written communication skills and the ability to work in a team environment is essential.

Application Deadline: 14 Feb 2011

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Postdoctoral Position in Advanced Packaging, Switzerland

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
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