micro fabrication | Scholarship for Nigerians and Africans

Engineering Postdoctoral Position in Microfluidics, Sungkyunkwan University, Korea

There is an opening for a postdoctoral researcher in the accelerator and Medical Engineering at the SKKU University, Republic of Korea. The initial term is one year, with the possibility of extension subject to performance review and funding availability.
The project is aimed at the development of automatically FDG production system using Microfluidics technology.
The applicant should have earned a Ph.D. in electrical engineering, mechanical engineering, chemical engineering, physics, or system design engineering. Candidates should have experience in the design and characterization of such devices as well as extensive experience in using multi-physics simulation tools (such as ANSYS). The candidate should be open-minded, ingenuous, energetic, and bring strong expertise in at least one of the fields of microfluidics, micro fabrication, system engineering, mass transport, cell biology, or microscopy. Candidates are invited to send by email with the subject “Postdoc in microfluidics” a cover letter, their complete curriculum vitae, the names of three references, and if published papers or manuscripts in preparation (preferred electronic format is pdf) to:

Accelerator and Medical engineering lab
Sungkyunkwan University (SKKU)
300 cheoncheon-dong, jangan-gu,Suwon,
Gyeonggi-do 440-746, korea

Scholarship Application Deadline: Contact Employer,jschai-at-skku.edu

Further Scholarship Information and Application

Postdoctoral Position in Advanced Packaging, Switzerland

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application