postdoctoral position | Scholarship for Nigerians and Africans - Part 10

Postdoctoral Positions in DNA Synthesis and Regulation at Department of Medical Biochemistry and Biophysics, Sweden

The research is focused on ribonucleotide reductase, a key enzyme in the synthesis of the DNA building blocks, dNTPs. One aim is to conditionally knock out the ribonucleotide reductase large subunit (R1) in differentiated mammalian cells to study:
i) The need for de novo dNTP synthesis for DNA repair in differentiated cells.
ii) The need for de novo dNTP synthesis for mitochondrial DNA replication and repair.
iii) The composition of the ribonucleotide reductase enzyme in differentiated cells. We also want to identify ribonucleotide reductase-interacting proteins using immunoprecipitations and chromatin immunopreciptations from synchronized mammalian cell extracts.

Methods:
The studies involve standard cell and molecular biology and biochemical techniques. Position description: The position is available for the initial 2 years as a tax-exempt fellowship with a possibility of extension. Location: The Department of Medical Biochemistry and Biophysics consists of 15 independent groups employing around 80 people. The department is located within the Chemical Biological Centre at Umeå University and provides well- equipped common facilities and excellent platforms in a creative, inspiring and highly interactive environment.
Fellowship Application Deadline: 31 January 2011
Further Fellowship Information and Application

Postdoctoral Position: Nanoelectromechanical Switch Devices for Logic Application, Switzerland

There is an immediate opening for a postdoctoral research position in the nanofabrication group at the IBM Research – Zurich laboratory for research on nanoelectromechanical (NEM) switch devices for logic applications.

To overcome the power issue of current CMOS technology, the microelectronic industry needs radically new devices that drastically improve the energy efficiency of microelectronic systems. One promising — yet still largely unexplored — technology is based on NanoElectroMechanical (NEM) switches, which are expected to produce significant improvements in energy efficiency. In this project, we are investigating the viability of this technology by developing a competitive and manufacturable device platform, by performing materials research to address inherent reliability issues, and by developing tools and methodologies to build complex logic.

To strengthen our interdisciplinary team, we are seeking a highly motivated individual with very good interpersonal skills and a strong background in designing and testing NEM systems as well as in applied materials science.

The successful candidate will play an important role in the design and testing of NEM devices. Â Hence we are seeking candidates who have a thorough understanding of the physics related to nanoscale electromechanical devices, experience in the design and characterization of such devices as well as extensive experience in using multi-physics simulation tools (such as ANSYS). Good knowledge of micro- and nanofabrication in addition to familiarity with logic design would be an asset.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application

Postdoctoral Position in Advanced Packaging, Switzerland

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application