January, 2011 | Scholarship for Nigerians and Africans - Part 126

Postdoctoral Position in Advanced Packaging, Switzerland

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application

Postdoctoral Position: Architecture and Circuit Design for Digital Logic based on Nanoelectromechanical Switch Devices, Switzerland

The traditional scaling of CMOS technology is increasingly constrained by power limitations (e.g., saturation of the clock frequency in microprocessors). Therefore the microelectronic industry is researching radically new devices that drastically improve the energy efficiency of microelectronic systems. One promising – still largely unexplored – technology is based on NanoElectroMechanical (NEM) switches which potentially offer significant improvements in energy efficiency. In this project, we investigate the viability of this technology by developing a competitive and manufacturable device, perform materials research to address inherent reliability issues, and develop tools and methodologies to build complex logic based on novel NEM switch devices.

To strengthen our team, we are seeking a highly motivated individual with very good interpersonal skills and a strong background in mixed-signal circuit design as well as in the design and implementation of MEMS/NEMS interface circuitry.
The successful candidate will have an important role in the system design of digital logic based on NEM switches. Hence we are seeking candidates having a thorough understanding of mixed-signal circuit design as well as a deep understanding the tools and methodologies used of in digital logic design. Basic knowledge in micro- and nanofabrication and interface circuitry to nanomechanical devices would be an additional asset.
Fellowship Application Deadline:
31/01/2011
Further Fellowship Information and Application

Art Elective Scholarship, Singapore: Art

The Art Elective Scholarship (AES) is offered by the Ministry of Education to encourage academically able and artistically talented students to pursue the rigorous art programme at H2 and H3 Level under the Art Elective Programme (AEP). AES is available at the following designated AEP centres:

  • Hwa Chong Institution;
  • Nanyang Junior College; and
  • National Junior College.

Scholarship Application Deadline: Applications will open in January 2011

Further Scholarship Information and Application