Engineering | Scholarship for Nigerians and Africans - Part 264

Postdoctoral Position: Architecture and Circuit Design for Digital Logic based on Nanoelectromechanical Switch Devices, Switzerland

The traditional scaling of CMOS technology is increasingly constrained by power limitations (e.g., saturation of the clock frequency in microprocessors). Therefore the microelectronic industry is researching radically new devices that drastically improve the energy efficiency of microelectronic systems. One promising – still largely unexplored – technology is based on NanoElectroMechanical (NEM) switches which potentially offer significant improvements in energy efficiency. In this project, we investigate the viability of this technology by developing a competitive and manufacturable device, perform materials research to address inherent reliability issues, and develop tools and methodologies to build complex logic based on novel NEM switch devices.

To strengthen our team, we are seeking a highly motivated individual with very good interpersonal skills and a strong background in mixed-signal circuit design as well as in the design and implementation of MEMS/NEMS interface circuitry.
The successful candidate will have an important role in the system design of digital logic based on NEM switches. Hence we are seeking candidates having a thorough understanding of mixed-signal circuit design as well as a deep understanding the tools and methodologies used of in digital logic design. Basic knowledge in micro- and nanofabrication and interface circuitry to nanomechanical devices would be an additional asset.
Fellowship Application Deadline:
31/01/2011
Further Fellowship Information and Application

Postdoctoral Position in Advanced Packaging, Switzerland

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application

Postdoctoral Position: Nanoelectromechanical Switch Devices for Logic Application, Switzerland

There is an immediate opening for a postdoctoral research position in the nanofabrication group at the IBM Research – Zurich laboratory for research on nanoelectromechanical (NEM) switch devices for logic applications.

To overcome the power issue of current CMOS technology, the microelectronic industry needs radically new devices that drastically improve the energy efficiency of microelectronic systems. One promising — yet still largely unexplored — technology is based on NanoElectroMechanical (NEM) switches, which are expected to produce significant improvements in energy efficiency. In this project, we are investigating the viability of this technology by developing a competitive and manufacturable device platform, by performing materials research to address inherent reliability issues, and by developing tools and methodologies to build complex logic.

To strengthen our interdisciplinary team, we are seeking a highly motivated individual with very good interpersonal skills and a strong background in designing and testing NEM systems as well as in applied materials science.

The successful candidate will play an important role in the design and testing of NEM devices. Â Hence we are seeking candidates who have a thorough understanding of the physics related to nanoscale electromechanical devices, experience in the design and characterization of such devices as well as extensive experience in using multi-physics simulation tools (such as ANSYS). Good knowledge of micro- and nanofabrication in addition to familiarity with logic design would be an asset.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application