materials research | Scholarship for Nigerians and Africans - Part 2

PhD Studentship in Materials Research, Nottingham Trent University, UK

/ March 30, 2011 Leave a Comment

The School of Architecture, Design and the Built Environment at Nottingham Trent University has an ambitious development strategy which allows us to offer an exciting opportunity for a PhD Studentship. The studentships will pay UK/EU fees and provide a maintenance stipend linked to the RCUK rate (£13,590 per annum for 2011/12) for up to three years. Applications are invited from those looking to pursue doctoral study in the subject area of materials research. The research area should aim to implement the scientific knowledge of innovative materials for high-performance applications and/or demonstrate the strategic use of resources utilising new materials and techniques for existing products and processes. Research areas could include a design application related to healthcare, energy, textiles, communication, displays/ lighting, plastics, packaging, sensors/sensing materials or nanotechnology.
The University has recently established a Materials Research Group. This is a new and ambitious innovation that aims to bring together researchers who share an interest in materials from across the University. The group also extends as a research hub connecting with higher education institutions, funding bodies and private enterprise world wide. It also allows individual members to communicate and engage with colleagues and external partners including innovation networks and knowledge transfer networks. The materials research group will also subscribe to a system to distribute research funding calls.

Scholarship Application Deadline: 15 April 2011

Further Scholarship Information and Application

Filed Under: Doctorate Degree, Engineering, Information Technology, Physical Science, Social Science Tags: , , , , , , , , ,

Postdoctoral Position: Architecture and Circuit Design for Digital Logic based on Nanoelectromechanical Switch Devices, Switzerland

/ January 17, 2011 Leave a Comment

The traditional scaling of CMOS technology is increasingly constrained by power limitations (e.g., saturation of the clock frequency in microprocessors). Therefore the microelectronic industry is researching radically new devices that drastically improve the energy efficiency of microelectronic systems. One promising – still largely unexplored – technology is based on NanoElectroMechanical (NEM) switches which potentially offer significant improvements in energy efficiency. In this project, we investigate the viability of this technology by developing a competitive and manufacturable device, perform materials research to address inherent reliability issues, and develop tools and methodologies to build complex logic based on novel NEM switch devices.

To strengthen our team, we are seeking a highly motivated individual with very good interpersonal skills and a strong background in mixed-signal circuit design as well as in the design and implementation of MEMS/NEMS interface circuitry.
The successful candidate will have an important role in the system design of digital logic based on NEM switches. Hence we are seeking candidates having a thorough understanding of mixed-signal circuit design as well as a deep understanding the tools and methodologies used of in digital logic design. Basic knowledge in micro- and nanofabrication and interface circuitry to nanomechanical devices would be an additional asset.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application

Filed Under: Engineering, Information Technology, Physical Science, Post Doctoral, Social Science Tags: , , , , , , , , , , ,

Postdoctoral Position in Advanced Packaging, Switzerland

/ January 17, 2011 Leave a Comment

A position is available immediately in the advanced thermal packaging project at the IBM Research – Zurich laboratory for research on novel packaging approaches with respect to heat removal and power / signal delivery for high-performance 3D-chip stacks. This effort supports IBM’s microprocessor platform and will strengthen its position as global leader in innovative thermal management and packaging solutions.

Requirements

We are seeking highly motivated individuals who are interested in joining our multi-disciplinary research team to extend packaging technology for high-performance computing platforms in the exascale era. Enabling technologies are the vertical integration of microprocessors and memory dies, as well as silicon photonic transceiver modules to improve communication bandwidth. The successful candidate will have a strong interdisciplinary background in physics, engineering, and material science (PhD). Required is a solid understanding of state-of-the-art thermo-mechanical modeling approaches and reliability testing methods. A broad knowledge in micro-fabrication and thermo-mechanical design is beneficial. The scope of the work spans from applied materials research to the development of novel packaging concepts tailored to vertical integration.
Fellowship Application Deadline: 31/01/2011
Further Fellowship Information and Application

Filed Under: Doctorate Degree, Engineering, Information Technology, Physical Science, Post Doctoral Tags: , , , , , , , , , , , , ,
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